The journey of rtldesign to gds is one of the most challenging integration activity of system integration.

The integration flow is exhaustive and proven for wide range of deep sub-micron technologies, i.e. 65n m, 90 nm , 130 nm , 250 nm and 350 nm processes and customised for various applications, i.e. wireless, networking, automotive.

LogicFabhassilicon proven exhaustive integration flow for designs targeted for deep sub-micron process. This flow has been proven on many silicon.